ACF Anisotropic Conductive Film

ACF (Anisotropic Conductive Film) or ACF Tape is an epoxy | acrylic adhesive system used to make electrical and mechanical connections between two substrates. Special conductive particles, made from environmental friendly material (ROHs compliance), are well distributed in the film and provides good metalic bonding and electrical connection. More importantly, ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.

ACF bonding has been gaining popularity in electronics assembly, especially in the electronics & LCD industries. Lately, ACF bonding has become one of the most preferred methods for bonding fine pitch connections, and is now being applied in a growing number of new automotive safety and driver assistance systems. The popularity of autonomous driving systems and increasing use of displays and camera’s will only increase this trend, as driverless vehicles will require even more communications and sensor applications.

In recent years, highly reliable ACF has been developed for the applications of Ultra-fine pitch bonding process. Nylon is used to produce a single layer film and integrated with well distributed conductive particles. This new structure restricts the movement of conductive particles and significantly enhances the captured rate of conductive particles, hence reducing chance of electrical short issues in the ultra-fine pitch assembly process.

ACF Bonding
Introduction to ACF Film.

ACF Working Mechanism

ACF Anisotropic Conductive Film are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).

The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film..

ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.
How It Works

ACF Bonding Process

ACF Process Steps
ACF is assembled in a thermocompression process with the following steps..
  • Step 1: Substrate Cleaning
  • Step 2: ACF Prebonding
  • Step 3: Remove cover Film
  • Step 4: Alignment
  • Step 5: Main/Final Bonding
  • Step 6: Completion

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