ACF Bonding Machines

Anisotropic Conductive Film ACF/TAB Bonding Machines

ACF/TAB Bonding machine is a system that ACF bonds two substrates (LCD, PCB, Flex, COF, IC Chip, FPC etc) using appropriate temperature, pressure and time

  • Anisotropic Conductive Film Bonding Machines & TAB Bonding Machines
  • Constant Heat Systems & Pulse Heat Systems
  • Vision Alignment System
  • Manual or Motorized stage/platform

ACF Bonding Applications: COB, COF, COG, COP, FOB, FOG,

TFT/LCD TV Repair Bonder 3T750/3T760

Function: ACF Bonding for TAB on to LCD and PCB

Programmable Carrier Table movement for productive assembly work

Caters to repairs of LCD up to 70 inches

LCD Repair Bonder

ACF Heat Bonder 3T980 with Rotary Table

For product max 120mm x 120mm

Rotary Table for Productivity

Suitable for Production use

Pulse Heat Rotary Table Bonding Machine

Constant Heat ACF Bonder (Table-Top) - 3T830

Function: Thermocompression bonding, Heat forming, ACF Bonding

For Product size max : 200mm x 150mm

Manual Stage

Vision Cameras up to 2 sets

ACF 3T830 Heat Bonder

Dual Head Constant Heat Bonding Machine 3T850

ACF Bonding to attach TAB/FPC to LCD/PCB

For LCD module max 5"

For LCD module line pitch above 0.18mm

Heating method : constant heating

Constant Heat Bonding Machine FFC,FPC Bonder Tab Bonder

Semi-Automatic COF/COG/COP Pre-bonding Machine 3T-COF003

To automatically peel and cut 1 or 2 layers ACF tape, and then attach to LCD, PCB, FPC, or TAB etc.

Heating method : constant heating

Max. length of bonding objects : Length 10 to 120 mm/ width 10 to 120mm

Accuracy : +/- 0.1mm

Temperature range : Room temp to 300degC

ACF Pre-bond Machine 3T710

This is a semi-automatic pre-bonding machine. It pre-bonds IC or COF on the Panel that has been attached to the Anisotropic conductive film (ACF). The pick and place of the Panel is achieved manually, and the pre-alignment is automatically completed by the equipment.

Semi-automatic ACF Pre-bond Machine

Dual Head COG/COF/COP/FOB Final Bonding Machine 3T-C012

This is a manual bonding machine and performs the main bonding on the LCD glass with IC, cable or COF pre-pressed. Operator manually loads and unloads the products, while ACF bonding is automatically performed by machine.

Dual Head Final Bonding Machine.jpg

Top-Bottom Alignment FOG/FOB Bonding Machine (Constant Heat) 3T-C006

This is a Top-Bottom alignment manual bonding machine, which bonds FPC/Zebra paper on the PCB/Glass with the Anisotropic conductive film (ACF) attached.

The pick and place and alignment of PCB/Panel are done manually, and ACF bonding is done automatically. Suitable for 1"~12" flat glass and flexible screen products bonding.

Constant heat bonding machine

Top-Bottom Alignment FOG/FOB Bonding Machine (Pulse Heat) 3T-P006

This is a Top-Bottom alignment manual bonding machine, which bonds FPC/Zebra paper on the PCB/Glass with the Anisotropic conductive film (ACF) attached.

The pick and place and alignment of PCB/Panel are done manually, and ACF bonding is done automatically. Suitable for 1"~12" flat glass and flexible screen products bonding.

Top bottom alignment bonding machine

Fully Automatic ACF Bonding Line

Including:

Substrates Loading Machine
Terminal Cleaning Machine
Fully Automatic COG/COF/COP Bonding Machine
Fully Automatic COF Punching Machine
Fully Automatic Flipping Machine
Fully Automatic FPC Loading Machine
Fully Automatic FOG/FOF/FOB/T-FOG Bonding Machine
Automatic Backlight Assembly Machine

Fully Automatic ACF Bonding Line
Contact us for more machines ...