ACF Anisotropic Conductive Film

ACF (Anisotropic Conductive Film) or ACF Tape is an epoxy | acrylic adhesive system used to make electrical and mechanical connections between two substrates

ACF Technology has been gaining popularity in electronics assembly, especially in the LCD industry.

ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.

Special conductive particle is made from environmental friendly material (ROHs compliance) and provides good metalic bonding.


Chip-on-board (COB)    Chip-on-flex COF

Chip-on-glass COG (Glass/Hyper-)    Chip-on-plastics COP

Flex-on-board (FOB)    Flex-on-Flex FOF

Flex-on-glass FOG (LCD/OLED)    OLB (LCD/OLED/Hyper-)

PCB    Camera Module

Touch (Glass/Film)    Fingerprint

About ACF

ACF Working Mechanism

ACF Anisotropic Conductive Film are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).

The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film..

ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.

ACF Process Steps

ACF Bonding Process

ACF is assembled in a thermocompression process with the following steps.

Step 1: Substrate Cleaning

Step 2: ACF Prebonding

Step 3: Remove cover Film

Step 4: Alignment

Step 5: Main/Final Bonding

Step 6: Completion