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Appication Information
Substrate Name S1
Electrode/Pad/Bump Pitch P1 (µm)
Electrode/Pad/Bump Width W1 (µm)
Electrode/Pad/Bump height H1 (µm)
Electrode/Pad/Bump Material M1 (µm)
Substrate Name S2
Electrode/Pad/Bump Pitch P2 (µm)
Electrode/Pad/Bump Width W2 (µm)
Electrode/Pad/Bump height H2 (µm)
Electrode/Pad/Bump Material M2 (µm)
Max Bonding Temp (°C)
ACF Film Width (mm)
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