ACF Products & Applications
| Application | STN-LCD | TFT-LCD | PCB/PWB | PDP |
| Pitch Size | 100um | 50um | 100um | 150um |
| Particle Size /Type | 10um Polymer ball | 3,4,5um Polymer ball | Avg 1um Ni ball Avg 5um Ni/Au | Avg 5um Ni/Au |
| Bonding condition | 180°C,10sec, 2.5MPa | 180°C,10sec, 2.5MPa | 180°C,15sec, 3MPa 160°C,8sec, 3MPa | 190°C,10sec, 3MPa |
| Target | Low Temp, Fast cure = 180°C, 5sec | 160°C, 7sec | 180°C, 7sec | |
| Application | COG | COF | Camera Module | Touch Panel |
| Pitch Size | 10um | 10um | 100um | >500um |
| Particle Size /Type | 3,4,5um Polymer ball | 3,4,5um Polymer ball | 10,20,30um Polymer ball | 5um (Metal ball) 20um (Polymer ball) |
| Min Bump/Min captured particle | 1600um2/5ea | 1600um2/5ea | -/40ea | - |
| Bonding condition | 180°C,5sec, 60MPa | 180°C,10sec, 3MPa | 180°C,10sec, 1.5MPa | 150°C,15sec, 2MPa |
| Target | Fine Pitch Application(12um under) | 180°C, 7sec | 140°C, 15sec | |
For Detail product specifications and price list, kindly
Contact us
Product Packaging & Reliability
- Core size : 18.5mm , 25.4mm
- Reel Size (Diameter) : 50M = Dia.96mm, 100M=Dia.126mm, 200M=Dia.195mm
- Width : 1.0, 1.2, 1.5, 2.0, 2.5, 3.0, 3.5 ...
- Storage condition: -5°C ~ 5°C sealed with moisture absorber
- Shelf Life
Packed : 6 month at -5°C ~ 5°C
Unpacked : 3 weeks under 25°C, 75%RH
After Pre-bonding: 72hr under 25°C, 75%RH
ACF Bonding Equipment
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These equipment are design to support ACF process / production requirements.
1) ACF Tape Attached Equipment
2) IC Alignment System
3) FPC/ TCP Alignment System
4) IC/ TAB / TCP Chip Bonding System
5) LCD Panel Inspection System
6) Ultrasonic Bonder
To meet your budget, we offer both the Manual and Semiautomatic Systems. Please enquire for more details.