What is ACF ?
ACF (or Anisotropic conductive film) is an epoxy system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates.
How does it work ?
During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.
Conductives particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.
This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).
The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.
As the epoxy cures and conductive particles are trapped into permanent compressed form.
The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions.
Applications
ACF has for many years,
been used in
glass display applications. Recently, it is also becoming
widely used in
COF and COB areas.
Examples of ACF applications.
-
TAB Bonding (TCP-PCB / TCP-LCD)
- COG Bonding
(IC-LCD)
- COB Bonding (IC-PCB)
- COF Bonding
(IC-FPC)
- Plasma Display (FPC-PDP)
