ACF Anisotropic Conductive Film
ACF (Anisotropic conductive film) or ACF tape is an epoxy adhesive system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates.
ACF are filled with conductive particles which provides electrical
interconnection between pads through the film thickness (z-direction).
The conductive particles are distributed far apart thus not
electrically conductive in the plane direction (X&Y) of the film.
ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.
ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.
Our special conductive particle is made from environmental friendly material (ROHs compliance). It provides good metalic bonding.
ACF Bonding
During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.
Conductives particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.
This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).
The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.
As the epoxy cures and conductive particles are trapped into permanent compressed form.
The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions.
Applications
ACF has for many years,
been used in
glass display applications. Recently, it is also becoming
widely used in
COF and COB areas.
Examples of ACF applications.
- TAB Bonding (TCP-PCB / TCP-LCD)
- COG Bonding
(IC-LCD)
- COB Bonding (IC-PCB)
- COF Bonding
(IC-FPC)
- Plasma Display (FPC-PDP)
- Flip Chip Package
ACF Types by Applications
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ACF
for Touch-Panel Bonding Features - Heat cure - Fast bonding time - High adhesion to plastic PET substrate - Excellent thermal stability - Good contact resistance for reliability - Good corrosion resistance |
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ACF
for FOF-FOB Bonding Features - Heat cure - Fast bonding time - High adhesion for COF & FPC - Good contact resistance for reliability - Excellent chemical resistance - Good for wide bonding temperature range - Replaces solder for lead-free solution |
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ACF
for COF Bonding Features : - Fine pitch interconnection : min 15um gap for COF application. - Minimum connecting area of bump : 1500um2. - High reliability and stable adhesion property on 2 layer PI film |
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ACF
for COG Bonding Features : Fine pitch interconnection : min. 6㎛ gap for COG application Minimum connecting area of bump: 800㎛2. High reliability and adhesion property. |
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ACF
for FOG Bonding Features : - Heat cure - Fine pitch connection : 50um pitch for TFT-LCD, color STN, EL, High adhesion, high reliability, void free bonding, and repairable by common solvents - Good thermal stability - Applicable for fine pitch OLB with shorter bonding time. |
| ACF Specifications |